Industrial Management in Microelectronics (M.Sc.)
Build semiconductor expertise and management skills for your career in microelectronics. Next Start: 1 October 2026
Study a full-time Master’s in Dresden that combines semiconductor technology, packaging, microsystems, operations, logistics and project management. Develop an industry-relevant profile for careers across the semiconductor value chain in one of Germany’s leading microelectronics locations.
Key Facts
Degree
Master of Science (M.Sc.)
Program start
1 October 2026
Duration
3 semesters / 18 months
(including Master’s thesis)Place of study
Dresden
Program type
Full-time
Credit points
90 ECTS
Lecture language
English
Tuition fee
€895 per month + €500 thesis fee
(additional fees only for additional modules listed on the page)
Key Benefits of the Master's Program
Study in Dresden’s microelectronics environment
Study in one of Germany’s leading microelectronics locations and develop an industry-relevant profile for the semiconductor value chain.
Combine engineering and management
Build expertise in semiconductor technology, packaging, microsystems, operations, logistics and project management in one integrated Master’s program.
Integrated German course for career entry in Germany
Improve your German for everyday life and prepare for applications and interviews in Germany through the integrated language modules.
Personal support in small study groups
Benefit from close academic support and small learning groups that enable targeted exchange throughout the program.
Is this Master’s program right for you?
This program is designed for graduates and early-career professionals with a technical background who want to deepen their expertise in microelectronics and build management skills for the semiconductor industry. It is especially relevant for applicants who want to connect engineering knowledge with operations, logistics and project work.
You may be a good fit for the degree program if you:
- Build semiconductor-specific expertise – strengthening your knowledge of semiconductor technology, electronic circuits, microsystems, sensor technology, and packaging across the microelectronics value chain.
- Work at the interface of technology and organization – coordinating engineers, suppliers, production teams, and management stakeholders in technically complex industrial environments.
- Prepare for leadership-oriented roles in high-tech industries – especially where technical understanding must be combined with planning, cost awareness, quality thinking, and process responsibility.
The degree program is particularly relevant if your next career step involves semiconductor project coordination, technical project management, production-related management, process management, or interface roles between R&D, operations, and business units.
Career Opportunities for Master's Graduates
The Master’s program “Industrial Management in Microelectronics (M.Sc.)” prepares graduates for specialist and management-oriented roles in the semiconductor industry and related high-tech sectors. The program combines semiconductor technology, packaging, microsystems, sensor technology, operations, logistics, project management, and investment and financing.
Possible career roles include:
- Semiconductor Project Manager
- Industrial Manager in Microelectronics
- Operations Manager in Semiconductor Manufacturing
- Process Manager
- Process Improvement Specialist
- Supply Chain Manager for Microelectronics
- Production Planning Manager
- Packaging Technology Coordinator
- Microsystems and Sensor Technology Manager
- Technical Business Development Manager in Semiconductors
- Investment and Business Case Analyst for High-Tech Projects
- Consultant in Semiconductor Operations and Strategy
- Technical Interface Manager between R&D, Production, and Business
Graduates are prepared to work at the interface of engineering, production, business, and management. They can support technical projects, optimize operational processes, connect engineering and business perspectives, and contribute to strategic decisions across the semiconductor value chain.
Industrial Management in Microelectronics (M. Sc.) Curriculum and Study Contents
The curriculum combines technical depth with management relevance. Students build knowledge in circuits and devices, semiconductor technology, packaging in microelectronics, microsystems and sensor technology, operations and logistics management, project management, investment and financing, and academic research skills. The program concludes with a Master’s thesis.
Curriculum at a Glance
- Semiconductor Technologies: circuits, devices, semiconductor manufacturing, packaging
- Systems & Applications: microsystems, sensor technology, production context
- Management & Execution: operations, logistics, project management, investment, academic research
Detailed module overview
Module 0.1 - Studium generale (14 ECTS)
Prof. Dr. Gerald Gerlach
This module brings together important subject areas that will help students 'arrive' in their new environment, bring them together and give them an insight into new cultures.
German class - part 1
A short test is taken at the beginning of the course to determine your level. On this basis, students learn the most important vocabulary and phrases to enable them to cope in everyday life. At the same time, students are familiarised with German culture.
German class - part 2
This part of the course focuses on language and professional work. Preparation of job applications plays an important role. Students also learn how to conduct job interviews and simulate interviews with companies.
Cultural and team competences
This course helps students to get to know and understand their fellow students and their cultures better. At the same time, students learn about team composition and the different roles in a team and their benefits and strengths. By solving creative tasks, students practise these roles and acquire important skills for leading teams in their future careers.
Sustainability project
After an intensive workshop in which the students receive the most important knowledge on the topic of sustainability, they work on a project of their own choice in which they put the theory they have learnt into practice and write it up.
Module 0.2 - Scientific Working (10 ECTS)
Prof. Dr. Rainer Lasch
Scientific Working - Part 1
This part serves to bring all students to a common level on the topic of ‘scientific working’. Students have knowledge of
- Purpose and Principles of Scientific Work
- Planning, Developing and Managing a thesis
- Developing a Topic, Cooperation with the supervisor
- Working with Literature/ Sources
- Writing a scientific Paper or Thesis
- Defence of the thesis
Scientific Working - part 2
The bootcamp is a training workshop, where students receive further training on the topic of “scientific working”, which enables them to
- write an individual term paper on a topic of their choice in accordance with the requirements of academic writing
- present the most important results of the written work in a concise manner within a given time frame
Scientific Working - part 3
This part serves to develop overarching competences in preparation for the master's thesis by deepening students' scientific working and writing skills in a targeted manner.
Students can:
- derive and formulate research questions, cite correctly and write an abstract independently
- conduct literature research and collect research-relevant data
- apply the basic scientific rules that must be observed when writing the master's thesis in a targeted manner - applying their knowledge from the previous modules
Module 1 - Circuits and Devices (5 ECTS)
Prof. Dr. Andreas Bahr
Electronic circuits and devices:
- Analog basic circuits
- Differential amplifiers
- Power amplifiers
- Operational amplifiers and their applications
- Power supply circuits and digital basic circuits
- Combinatorial and sequential circuits
Module 2 - Semiconductor Technology I / II (10 ECTS)
Prof. Dr. Stefan Mannsfeld
Fabrication technology of semiconductor device
- Semiconductor basics
- IC device and design
- Semiconductor manufacturing processes
- Basic principles of fabrication and miniaturization
- thermal processes and lithography
- Interaction between physical fundamentals and function principles
Module 3 - Packaging in Microelectronics I / II (8 ECTS)
Prof. Dr. Thomas Zerna
- Trends in electronic packaging
- Packaging technologies for semiconductor devices and systems
- Thin-film & Thick-film technologies
- Printed circuit board (PCB) and interposer technologies
- Surface technologies for electronic components
Module 4 - Operations & Logistics Management I/II (8 ECTS)
Prof. Dr. Rainer Lasch
- Logistics subsystem
- Aspects of process modelling and process
- performance
- Concepts to improve business processes
- Supply Chain Management
- Material requirement planning
Module 5 - Microsystems and Sensor Technology (5 ECTS)
Prof. Dr. Gerald Gerlach
- Microsystem technology
- Sensor technology
Module 6 - Project Management (5 ECTS)
Prof. Dr. Thorsten Schmid
- Introduction to project fundamentals
- Industrial environment analysis
- Methods for job & project design
- Applicable to all project types
Module 7 - Investment and Financing (5 ECTS)
Prof. Dr. Mario Straßberger
- Investment appraisal: techniques to assess investment attractiveness
- Business case focus: justify costs by valuing benefits
Corporate finance: optimal financial decision-making
Master Thesis (20 ECTS)
- Thesis
- Kolloquium
Scientific Directors
Prof. Dr. Rainer Lasch
Chair of Business Management, esp. Logistics, Technische Universität Dresden (TUD)
Prof. Dr. Gerald Gerlach
Institute of Solid-State Electronics, Technische Universität Dresden (TUD)
Lecturers (Extract)
- Prof. Dr. Rainer Lasch
Chair of Business Management, esp. Logistics, Technische Universität Dresden (TUD) - Prof. Dr. Gerald Gerlach
Institute of Solid-State Electronics, Technische Universität Dresden (TUD) - Prof. Dr. Thorsten Schmidt
Chair of Material Handling, Technische Universität Dresden (TUD - Prof. Dr. Stefan Mannsfeld
Chair of Organic Devices, Center for Advancing Electronics Dresden (cfaed), Technische Universität Dresden (TUD) - Prof. Dr.-Ing. habil. Thomas Zerna
Director of the Centre for Microtechnical Production, Electrical and Computer Engineering Department, Technische Universität Dresden (TUD) - Prof. Dr. Mario Straßberger
University of Applied Sciences Zittau-Görlitz
Cooperation & Network
Admission Requirements & Eligibility Check
To apply for the program, you need a recognised college or university degree equivalent to 210 ECTS, at least one year of professional experience, a relevant technical background, and advanced English skills.
Eligibility Check
- Do you hold a recognised university degree equivalent to 210 ECTS?
- Do you have at least one year of professional experience?
- Is your academic or professional background related to electrical engineering, electronics, microelectronics, information technology, mechatronics, physics, nanotechnology or automation?
- Can you provide proof of advanced English such as TOEFL 570 / iBT 79 / IELTS 6.0 or equivalent?
Personal advice
Early Bird Advantage
- Apply by 30 June 2026 and get one month instalment for free for the fall start 2026.
- Save €895 with an early application.
- We will be happy to advise you in a personal meeting.
- All requirements can be found here.
"Bring a Friend!" Advantage: Studying together is more fun!
- As a DIU student, recruit a friend as a fellow student.
- As a referring DIU student, we will give you one free monthly instalment.
- All requirements can be found here.
FAQ
What makes this program different from a purely technical Master’s?
The program combines semiconductor technology with operations, logistics and project management, preparing students for technical and cross-functional roles in the industry.
What are the main focus areas of the curriculum?
The curriculum covers semiconductor technology, packaging, microsystems, sensor technology, operations and logistics management, project management, and applied academic research.
What career paths can this degree prepare me for?
Graduates can build profiles for roles in semiconductor manufacturing, packaging, microsystems, operations, logistics and project-based functions across the semiconductor industry.
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